n

EarComp 2024

5th International Workshop on Earable Computing
In conjunction with UbiComp 2024, Melbourne, Australia
Date: TBC

(EarComp 2023)
(EarComp 2022)
(EarComp 2021)
(EarComp 2019)

Overview

Sensory earables are increasingly becoming a mainstream compute platform with a promise to fundamentally transform personal-scale human sensing applications. Over the past few years, a number of research efforts in the ubiquitous computing domain have sought to achieve useful, engaging, and sometimes ambitious behavioural analytics with sensory earables including studies of the human face; of emotion and stress; continuous monitoring of cardiovascular function; oxygen consumption and blood flow; and tracking eating episodes as well as dietary and swallowing activities. At the same time, we have started seeing commercial efforts such as Bragi's The Dash, Bose SoundSport, Jabra Elite Sport, and Sony Xperia offering music experience augmented with sensory services including fitness tracking, real-time translations and conversational agents. Naturally, earables are becoming an intense interdisciplinary area of study with many and diverse applications including HCI, empathic communication, behavioural science, health and wellbeing, entertainment, education, and security.

However, as of today, earable computing lacks an academic forum to bring together researchers, practitioners, and design experts from academia and industry to discuss, share, and shape this exciting new area of research. To this end, we are organising the third workshop on Earable Computing with a hope that this workshop will serve as a catalyst for advancements in sensory earable technology as well as present a clear sense of direction for the research community to proceed in this space.

Keynotes

To be announced


Call For Papers

We will solicit three categories of papers.
  • Full papers (up to 6 pages including references) should report a reasonably mature work with earables, and is expected to demonstrate concrete and reproducible results albeit scale may be limited.
  • Experience papers (up to 4 pages including references) that present extensive experiences with implementation, deployment, and operations of earable-based systems. Desirable papers are expected to contain real data as well as descriptions of the practical lessons learned.
  • Short papers (up to 2 pages including references) are encouraged to report novel, and creative ideas that are yet to produce concrete research results but are at a stage where community feedback would be useful.
  • Moreover, we will have a special submission category - "Dataset Paper" - soliciting a 1-2 page document describing a well curated and labelled dataset collected with earables (eventually accompanied by the dataset).

    All papers will be in ACM sigconf template with 2 columns and all of the accepted papers (regardless of category) will be included in the ACM Digital Library. All papers will be digitally available through the workshop website, and the UbiComp/ISWC 2024 Adjunct Proceedings. For each category of papers, we will offer a "Best Paper" and "Best Dataset" awards sponsored by Nokia Bell Labs.


    Topics of interest (NOT an exhaustive list):
  • Acoustic Sensing with Earables
  • Kinetic Sensing with Earables
  • Multi-Modal Learning with Earables
  • Multi-Task Learning with Earables
  • Active Learning with Earables
  • Low-Power Sensing Systems for Earables
  • Authentication & Trust mechanisms for Earables
  • Quality-Aware Data Collection with Earables
  • Experience Sampling with Earables
  • Crowd Sourcing with Earables
  • Novel UI and UX for Earables
  • Auditory Augmented Reality Application with Earables
  • Lightweight Deep Learning on Earables
  • Tiny Machine Learning on Earables
  • Health and Wellbeing Applications of Earables
  • Emerging applications of Earables




  • Submission & Timeline

    While the workshop will accept papers describing completed work as well as work-in-progress, the emphasis is on early discussion of novel and radical ideas (potentially of a controversial nature) rather than detailed description and evaluation of incremental advances.

    Submissions must be no longer than 6 pages (including references) for Full Papers, 4 pages (including references) for Experience Papers, and 2 pages (including references) for Interactive Posters and Vision Papers and must be in PDF format. Reviews will be double-blind: no names or affiliation should be included in the submission.

    The submission template can be downloaded from ACM site.
    Alternatively, the Overleaf version can be found here.

    Latex documents should use the “sigconf” template style. Word users should use the interim template downloadable from the ACM site.

    Submission Site: https://new.precisionconference.com/submissions

    Submission Instructions: to select the appropriate track choose "SIGCHI" in the field Society, "Ubicomp/ISWC 2024" as Conference, and, finally, pick "Ubicomp/ISWC 2024 EarComp" as Track.

    • Submission Deadline: TBC
    • Acceptance Notification: TBC
    • Camera Ready Deadline: TBC
    For any question/concern, get in touch with earcomp@esense.io.

    Organisers

    General Chairs
    Alessandro Montanari, Nokia Bell Labs Cambridge
    Andrea Ferlini, Nokia Bell Labs Cambridge

    Program Chairs
    Nirupam Roy, University of Maryland, College Park (UMD)
    Xiaoran "Van" Fan, Google
    Longfei Shangguan, University of Pittsburgh

    Steering Committee
    Fahim Kawsar, Nokia Bell Labs, Cambridge
    Alessandro Montanari, Nokia Bell Labs Cambridge
    Andrea Ferlini, Nokia Bell Labs Cambridge

    Web, Publicity and Publication
    Jake Stuchbury-Wass, University of Cambridge
    Yang Liu, Nokia Bell Labs Cambridge

    Program Committee
    Dong Ma, Singapore Management University
    Marios Costantinides, Nokia Bell Labs Cambridge
    Yang Liu, University of Cambridge
    Yang Liu, Nokia Bell Labs Cambridge
    Ting Dang, Nokia Bell Labs Cambridge
    Khaldoon Al-Naimi, Nokia Bell Labs Cambridge
    Ashok Thangarajan, Nokia Bell Labs Cambridge
    Shijia Pan, UC Merced
    Jagmohan Chauhan, University of Southampton
    Jay Prakash, Silence Laboratories, Singapore
    Jun Han, Yonsei University
    Wen Hu, UNSW Sydney
    Zhenyu Yan, Chinese University of Hong Kong
    Mi Zhang, Michigan State University
    Rajalakshmi Nandakumar, Cornell Tech
    Bashima Islam, Worcester Polytechnic Institute
    VP Nguyen, University of Texas at Arlington/UMass Amherst
    Ho-Hsiang Wu, Bosch, USA